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9/24/03 Oxford Performance Materials, Inc. (OPM) and Hi-Tech Mold and Tool have jointly developed coating technology that dramatically improves semiconductor wafer handling. The ultra pure high performance OXPEKK®
thermoplastic polymer is being injection-molded around the tip of a stainless steel substrate (wafer edge grip), thus maintaining rigidity with minimum contamination and minimum wear over hundreds of thousands of gripping cycles. The process ensures that the OXPEKK
thermoplastic polymer makes direct contact with the semiconductor wafer where prevention of contamination is most critical. "The OXPEKK wafer edge grip process has doubled the lifespan of the wafer
grippers," noted Lynne Thoma, Director of Research and Development for OPM. "This is critical in the semiconductor
equipment industry, when systems are running around the clock. In addition to decreased wear, distortion of the silicon wafer during gripping is noticeably
decreased." OPM has worked jointly with Hi-Tech Mold and Tool to develop the edge grip over-molding process. The process offers excellent repeatability and can accommodate both low and high volume applications. Hi-Tech Mold and Tool is a full service injection molder of engineering thermoplastics, supplying custom molded parts for the medical, aerospace, consumer, automotive and semiconductor markets. Hi-Tech Mold and Tool is located in Pittsfield, MA in their modern 55,000 sq. ft. facility, featuring a 5,000 sq. ft. class 100,000 clean room and 5,000 sq. ft. tool room. Founded in 2000, OPM has rapidly become an industry leader in the high-performance thermoplastic
polymers market. Focusing on semiconductor equipment applications, OPM actively develops advanced material solutions to improve yields and lower overall cost of ownership. The firm's versatile OXPEKK®
thermoplastic polymers are currently being used in aerospace, medical, semiconductor, and industrial markets worldwide. For additional information, contact
info@oxfordpm.com.
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